By Ning-Cheng Lee
Written utilizing a really functional, hands-on technique, Reflow Soldering techniques and Troubleshooting offers the skill for engineers to extend their figuring out of the rules of soldering, flux, and solder paste know-how. the writer enables studying approximately different crucial subject matters, comparable to region array packages--including BGA, CSP, and FC designs, bumping method, meeting, and remodel process,--and offers an elevated knowing of the reliability failure modes of soldered SMT elements. With price effectiveness leading in brain, this publication is designed to troubleshoot mistakes or difficulties sooner than forums pass into the producing technique, saving time and cash at the entrance finish. The author's significant services and information make sure that assurance of issues is expertly researched, written, and arranged to top meet the wishes of producing method engineers, scholars, practitioners, and somebody with a wish to study extra approximately reflow soldering strategies. entire and integral, this booklet will end up an ideal education and reference instrument that readers will locate invaluable.
Provides engineers the state-of-the-art expertise in a speedily altering field
Offers in-depth insurance of the foundations of soldering, flux, solder paste know-how, sector array packages--including BGA, CSP, and FC designs, bumping method, meeting, and the transform process
Read or Download Reflow Soldering Processes: SMT, BGA, CSP and Flip Chip Technologies PDF
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